- Compact table top design.
- Auto shutoff on completion.
- Splash guard for clean and safe operation.
- Easily changeable blades.
- Splash guard kit
- Irregular sample holder
Parameter Specifications Cutting Speed 30 to 300 rpm Load Range Up to 250 gm Blade Size 125 X 0.3 mm Bore Diameter of Blade 12.7 mm
The Ducom Precision Sectioning Saw is a low speed saw that uses diamond wafering blades for cutting various types of materials. This is a great tool for every lab to have for sample preparation and sample sectioning for analysis. The low speed of cutting provides a very high quality of cut, while minimizing damage to the sample.
Samples can be aligned using a micrometer, for precise placement of cut. Samples are gravity fed and sample holders allow users to hold a variety of sample shapes confidently. It is suitable for materials such as metals, semiconductors, ceramics, minerals, composites, coated samples, electronic components and more.