Precision Sectioning Saw (Low Speed)

The Ducom Precision Sectioning Saw is a low speed saw that uses diamond wafering blades for cutting various types of materials. This is a great tool for every lab to have for sample preparation and sample sectioning for analysis. The low speed of cutting provides a very high quality of cut, while minimizing damage to the sample.

Samples can be aligned using a micrometer, for precise placement of cut. Samples are gravity fed and sample holders allow users to hold a variety of sample shapes confidently. It is suitable for materials such as metals, semiconductors, ceramics, minerals, composites, coated samples, electronic components and more.

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